TRA-BOND 2104乐泰胶水, 环氧树脂胶
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TRA-BOND 2104是推荐用于关键电子，航空航天和工业粘合，层压和增强应用的触变环氧树脂系统，需要具有高填充，无凹陷特性的粘合剂。 这种两部分无溶剂的粘合剂易于混合，用于将部件加工到印刷电路板上，以提高机械刚度，以及用于金属，玻璃，陶瓷，木材和许多塑料的粘合，层压和修复应用。 TRA-BOND 2104硬化到坚韧的搪瓷涂层，具有良好的耐化学性以及优异的物理和机械性能。 固化的粘合剂提供良好的电绝缘性和耐候性，电动作用，石油产品和润滑剂，醇，盐，弱酸和碱以及其他有机和无机化合物。
TRA-BOND 2104 is a thixotropic epoxy system recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-sag characteristics. This two-part, solvent-free adhesive is easily mixed and used for staking components to printed circuit boards for enhanced mechanical rigidity, and for bonding, laminating and repair applications involving metals, glass, ceramics, wood and many plastics. TRA-BOND 2104 hardens to a tough, enamel-like coating offering good chemical resistance as well as superior physical and mechanical properties. The cured adhesive provides good electrical insulation and resistance to weather, galvanic action, petroleum products and lubricants, alcohol, salts, mild acids and alkalis, and other organic and inorganic compounds |
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