ABLETHERM 3185乐泰胶水, 芯片胶
ABLETHERM 3185乐泰胶水, 芯片胶
ABLETHERM 3185乐泰胶水, 芯片胶
ABLETHERM 3185乐泰胶水, 芯片胶
ABLETHERM 3185乐泰胶水, 芯片胶
ABLETHERM 3185乐泰胶水, 芯片胶
ABLETHERM 3185乐泰胶水, 芯片胶
ABLETHERM 3185乐泰胶水, 芯片胶
ABLETHERM 3185乐泰胶水, 芯片胶
ABLETHERM 3185乐泰胶水, 芯片胶
ABLETHERM 3185乐泰胶水, 芯片胶
ABLETHERM 3185乐泰胶水, 芯片胶
ABLETHERM 3185乐泰胶水, 芯片胶
ABLETHERM 3185乐泰胶水, 芯片胶
ABLETHERM 3185乐泰胶水, 芯片胶
ABLETHERM 3185乐泰胶水, 芯片胶
ABLETHERM 3185乐泰胶水, 芯片胶
ABLETHERM 3185乐泰胶水, 芯片胶
ABLETHERM 3185乐泰胶水, 芯片胶
ABLETHERM 3185乐泰胶水, 芯片胶
ABLETHERM 3185乐泰胶水, 芯片胶
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ABLETHERM 3185粘合剂设计用于热 增强倒装芯片BGA应用。 这银色 Sycar粘合剂表现出高热和电 电导率。 材料的低模量使它 适用于将IC连接到集成散热器中 层压FCBGA应用治疗过程数据 3185 推荐治疗条件 60分钟@175žC 替代治疗条件 60分钟@ 100％C @ 60分钟@ 175℃ 储存寿命@40 o C 6个月
ABLETHERM 3185 Adhesive Designed for Thermal Enhanced Flip Chip BGA Applications. This silver Sycar adhesive exhibits high heat and electrical conductivity. Low modulus of the material makes it suitable for connecting ICs to integrated heat sinks. FCBGA Application Process Data 3185 Recommended Treatment Conditions 60 min @ 175 zC Alternative Treatment Condition 60 min @ 100% C @ 60 min @ 175 ° C Storage Life @ 40 O C 6 month |
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